ZHCSJ03B November 2018 – February 2024 TMUX1108
PRODUCTION DATA
| THERMAL METRIC(1) | DEVICE | DEVICE | UNIT | |
|---|---|---|---|---|
| PW (TSSOP) | RSV (QFN) | |||
| 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 118.9 | 134.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 49.3 | 74.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 65.2 | 62.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 7.6 | 4.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 64.6 | 61.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |