ZHCSOF3G April   2006  – July 2021 TLV320AIC3106

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
4. 4 Revision History
5. 5 說明（續(xù)）
6. 6 Device Comparison Table
7. 7 Pin Configuration and Functions
8. 8 Specifications
   1. 8.1 Absolute Maximum Ratings
   2. 8.2 ESD Ratings
   3. 8.3 Recommended Operating Conditions
   4. 8.4 Thermal Information
   5. 8.5 Electrical Characteristics
   6. 8.6 Timing Requirements: Audio Data Serial Interface (1)
   7. 8.7 Timing Diagrams
   8. 8.8 Typical Characteristics
9. 9 Parameter Measurement Information
10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
       1. 10.3.1  Hardware Reset
       2. 10.3.2  Digital Audio Data Serial Interface
          1. 10.3.2.1 Right-Justified Mode
          2. 10.3.2.2 Left-Justified Mode
          3. 10.3.2.3 I2S Mode
          4. 10.3.2.4 DSP Mode
          5. 10.3.2.5 TDM Data Transfer
       3. 10.3.3  Audio Data Converters
          1. 10.3.3.1 Audio Clock Generation
          2. 10.3.3.2 Stereo Audio ADC
             1. 10.3.3.2.1 Stereo Audio ADC High-Pass Filter
             2. 10.3.3.2.2 Automatic Gain Control (AGC)
                1. 10.3.3.2.2.1 Target Level
                2. 10.3.3.2.2.2 Attack Time
                3. 10.3.3.2.2.3 Decay Time
                4. 10.3.3.2.2.4 Noise Gate Threshold
                5. 10.3.3.2.2.5 Maximum PGA Gain Applicable
          3. 10.3.3.3 Stereo Audio DAC
             1. 10.3.3.3.1 Digital Audio Processing for Playback
             2. 10.3.3.3.2 Digital Interpolation Filter
             3. 10.3.3.3.3 Delta-Sigma Audio DAC
             4. 10.3.3.3.4 Audio DAC Digital Volume Control
             5. 10.3.3.3.5 Increasing DAC Dynamic Range
             6. 10.3.3.3.6 Analog Output Common-Mode Adjustment
             7. 10.3.3.3.7 Audio DAC Power Control
       4. 10.3.4  Audio Analog Inputs
       5. 10.3.5  Analog Fully Differential Line Output Drivers
       6. 10.3.6  Analog High Power Output Drivers
       7. 10.3.7  Input Impedance and VCM Control
       8. 10.3.8  General-Purpose I/O
       9. 10.3.9  Digital Microphone Connectivity
       10. 10.3.10 Micbias Generation
       11. 10.3.11 Short Circuit Output Protection
       12. 10.3.12 Jack/Headset Detection
    4. 10.4 Device Functional Modes
       1. 10.4.1 Bypass Path Mode
          1. 10.4.1.1 Analog Input Bypass Path Functionality
          2. 10.4.1.2 ADC PGA Signal Bypass Path Functionality
          3. 10.4.1.3 Passive Analog Bypass During Powerdown
       2. 10.4.2 Digital Audio Processing for Record Path
    5. 10.5 Programming
       1. 10.5.1 Digital Control Serial Interface
          1. 10.5.1.1 SPI Control Mode
             1. 10.5.1.1.1 SPI Communication Protocol
             2. 10.5.1.1.2 Limitation on Register Writing
             3. 10.5.1.1.3 Continuous Read / Write Operation
          2. 10.5.1.2 I2C Control Interface
             1. 10.5.1.2.1 I2C BUS Debug in a Glitched System
    6. 10.6 Register Maps
       1. 10.6.1 Output Stage Volume Controls
11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
       1. 11.2.1 Design Requirements
       2. 11.2.2 Detailed Design Procedure
       3. 11.2.3 Application Curves
12. 12Power Supply Recommendations
13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Examples
14. 14Device and Documentation Support
    1. 14.1 接收文檔更新通知
    2. 14.2 支持資源
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 術(shù)語(yǔ)表