ZHCSBX7D December 2013 – June 2015 TLV1701 , TLV1702 , TLV1704
PRODUCTION DATA.
- 1 特性
- 2 應用范圍
- 3 說明
- 4 修訂歷史記錄
- 5 Device Comparison
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Applications and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機械、封裝和可訂購信息
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
7 Specifications
7.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply voltage | +40 (±20) | V | ||
| Signal input pins | Voltage(2) | (VS–) – 0.5 | (VS+) + 0.5 | V |
| Current(2) | ±10 | mA | ||
| Output short-circuit(3) | Continuous | mA | ||
| Operating temperature range | –55 | +150 | °C | |
| Junction temperature, TJ | 150 | °C | ||
| Storage temperature, Tstg | –65 | +150 | °C | |
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be current limited to 10 mA or less.
(3) Short-circuit to ground; one comparator per package.
7.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| TLV1701 and TLV1702 | ||||
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1500 | |||
| TLV1704 | ||||
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±1000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1500 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| Supply voltage VS = (VS+) – (VS–) | 2.2 (±1.1) | 36 (±18) | V | ||
| Specified temperature | –40 | 125 | °C | ||
7.4 Thermal Information: TLV1701
| THERMAL METRIC(1) | TLV1701 | UNIT | |||
|---|---|---|---|---|---|
| DRL (SOT553) | DCK (SC70) | DBV (SOT23) | |||
| 5 PINS | 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 271.5 | 283.6 | 233.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 115.6 | 94.1 | 156.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 89.7 | 61.3 | 60.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 17.6 | 1.9 | 35.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 89.2 | 60.5 | 59.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
7.5 Thermal Information: TLV1702 and TLV1704
| THERMAL METRIC(1) | TLV1702 | TLV1704 | UNIT | ||
|---|---|---|---|---|---|
| RUG (QFN) | DGK (VSSOP) | PW (TSSOP) | |||
| 8 PINS | 8 PINS | 14 PINS | |||
| θJA | Junction-to-ambient thermal resistance | 205.6 | 199 | 128.1 | °C/W |
| θJCtop | Junction-to-case (top) thermal resistance | 77.1 | 89.5 | 56.5 | °C/W |
| θJB | Junction-to-board thermal resistance | 107.0 | 120.4 | 69.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 2.0 | 22.0 | 9.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 107.0 | 118.7 | 69.3 | °C/W |
| θJCbot | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |
7.6 Electrical Characteristics
at TA = +25°C, VS = +2.2 V to +36 V, CL = 15 pF, RPULLUP = 5.1 kΩ, VCM = VS / 2, and VS = VPULLUP (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| OFFSET VOLTAGE | |||||||
| VOS | Input offset voltage | TA = 25°C, VS = 2.2 V | ±0.5 | ±3.5 | mV | ||
| TA = 25°C, VS = 36 V | ±0.3 | ±2.5 | mV | ||||
| TA = –40°C to +125°C | ±5.5 | mV | |||||
| dVOS/dT | Input offset voltage drift | TA = –40°C to +125°C | ±4 | ±20 | μV/°C | ||
| PSRR | Power-supply rejection ratio | 15 | 100 | μV/V | |||
| TA = –40°C to +125°C | 20 | μV/V | |||||
| INPUT VOLTAGE RANGE | |||||||
| VCM | Common-mode voltage range | TA = –40°C to +125°C | (V–) | (V+) | V | ||
| INPUT BIAS CURRENT | |||||||
| IB | Input bias current | 5 | 15 | nA | |||
| TA = –40°C to +125°C | 20 | nA | |||||
| IOS | Input offset current | 0.5 | nA | ||||
| CLOAD | Capacitive load drive | See Typical Characteristics | |||||
| OUTPUT | |||||||
| VO | Voltage output swing from rail | IO ≤ 4 mA, input overdrive = 100 mV, VS = 36 V |
900 | mV | |||
| IO = 0 mA, input overdrive = 100 mV, VS = 36 V |
600 | mV | |||||
| ISC | Short circuit sink current | 20 | mA | ||||
| Output leakage current | VIN+ > VIN– | 70 | nA | ||||
| POWER SUPPLY | |||||||
| VS | Specified voltage range | 2.2 | 36 | V | |||
| IQ | Quiescent current (per channel) | IO = 0 A | 55 | 75 | μA | ||
| IO = 0 A, TA = –40°C to +125°C | 100 | μA | |||||
7.7 Switching Characteristics
at TA = +25°C, VS = +2.2 V to +36 V, CL = 15 pF, RPULLUP = 5.1 kΩ, VCM = VS / 2, and VS = VPULLUP (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| tpHL | Propagation delay time, high-to-low | Input overdrive = 100 mV | 460 | ns | ||
| tpLH | Propagation delay time, low-to-high | Input overdrive = 100 mV | 560 | ns | ||
| tR | Rise time | Input overdrive = 100 mV | 365 | ns | ||
| tF | Fall time | Input overdrive = 100 mV | 240 | ns | ||
7.8 Typical Characteristics
at TA = +25°C, VS = +5 V, RPULLUP = 5.1 kΩ, and input overdrive = 100 mV (unless otherwise noted)
