4 修訂歷史記錄
Changes from C Revision (December 2014) to D Revision
-
已將文檔狀態從“混合狀態”更改為“量產數據”Go
-
已將 TLV1702 RUG 封裝的狀態更改為量產數據Go
Changes from B Revision (October 2014) to C Revision
-
TLV1701 DCK 封裝已從預覽更改為量產數據Go
-
Changed Handling Ratings table to ESD Ratings table, and moved storage temperature to Absolute Maximum Ratings tableGo
Changes from A Revision (September 2014) to B Revision
-
更改了器件信息表中的腳注 2：已將 TLV1701 添加到可用器件列表中Go
-
Added TLV1701 to list of production data packages in footnote for the Pin Configuration and Functions section Go
-
Added TLV1701 row to V(ESD) parameter in Handling Ratings tableGo
Changes from * Revision (December 2013) to A Revision
-
已將文檔格式更改為符合最新的數據表標準；添加了新章節并移動了現有章節Go
-
TLV1704 PW (TSSOP-14) 封裝已從預覽更改為量產數據Go
-
在集電極開路輸出特性中添加了分項Go
-
在說明部分添加了第二段Go
-
已從說明部分中刪除封裝信息；冗余信息Go
-
Changed Related Products table to Device Comparison table, moved from page 1, and added TLV370x familyGo
-
Added TLV1701, TLV1702 RUG, and TLV704 package drawingsGo
-
Added thermal information for TLV1702 RUG, TLV1704 PW, and all TLV1701 packagesGo
-
Moved switching characteristics parameters from Electrical Characteristics table to new Switching Characteristics tableGo
-
Changed all typical values in Switching Characteristics tableGo
-
Changed title for Figure 1Go
-
Changed Figure 8Go
-
Changed Figure 9Go
-
Changed Figure 10Go
-
Changed Figure 11Go
-
Changed Figure 12Go
-
Changed Figure 13Go
-
Changed Figure 14Go
-
ChangedApplication Information and moved section Go
-
Deleted Application Examples sectionGo