ZHCSFO7A November 2016 – May 2018 TLV170 , TLV2170 , TLV4170
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV4170 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 93.2 | 106.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 51.8 | 24.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 49.4 | 59.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 13.5 | 0.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 42.2 | 54.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |