ZHCSH92D December 2017 – June 2022 TLIN2022-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | D (SOIC) | DMT (VSON) | UNIT | |
|---|---|---|---|---|
| 14-PINS | 14-PINS | |||
| RΘJA | Junction-to-ambient thermal resistance | 82.3 | 35.5 | °C/W |
| RΘJC(top) | Junction-to-case (top) thermal resistance | 41.5 | 18.1 | °C/W |
| RΘJB | Junction-to-board thermal resistance | 38.4 | 13.1 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 8.9 | 0.6 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 38.1 | 13.1 | °C/W |
| RΘJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | 2.5 | °C/W |