ZHCSMC0A December 2020 – April 2022 TLIN1029A-Q1
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 說明（續）
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3
Feature Description
- 9.3.1 LIN (Local Interconnect Network) Bus
- 9.3.2 TXD (Transmit Input and Output)
- 9.3.3 RXD (Receive Output)
- 9.3.4 VSUP (Supply Voltage)
- 9.3.5 GND (Ground)
- 9.3.6 EN (Enable Input)
- 9.3.7 Protection Features
- 9.3.8 TXD Dominant Time Out (DTO)
- 9.3.9 Bus Stuck Dominant System Fault: False Wake Up Lockout
- 9.3.10 Thermal Shutdown
- 9.3.11 Under Voltage on VSUP
- 9.3.12 Unpowered Device and LIN Bus
- 9.4 Device Functional Modes
- 10Application Information Disclaimer
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
- DRB|8
訂購信息
13.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |