ZHCSK68B August 2019 – June 2022 TLIN1028-Q1
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 說明（續）
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3 Feature Description
- 9.4 Device Functional Modes
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
7.9 Typical Characteristics
| Package = D | VCC = 3.3 V | Temp = Ambient |
| Package = DDA | VCC = 3.3 V | Temp = Ambient |
| Package = DRB | VCC = 5 V | Temp = Ambient |
Note:
Figure 7-7 Sleep Mode Current Across VSUP and Temperature| Package = D | VCC = 3.3 V | Temp = Ambient |
| Package = DDA | VCC = 3.3 V | Temp = Ambient |
| Package = DRB | VCC = 5 V | Temp = Ambient |
| Package = DRB | VCC = 3.3 V | Temp = Ambient |
| Package = D | VCC = 5 V | Temp = Ambient |
| Package = DDA | VCC = 5 V | Temp = Ambient |
| Package = DRB | VCC = 3.3 V | Temp = Ambient |
| Package = D | VCC = 5 V | Temp = Ambient |
| Package = DDA | VCC = 5 V | Temp = Ambient |
Note: For
the LDO ICC vs VSUP vs Temperature typical curves the data was
collected on a high-k EVM board using a forced air system. The curves show
performance based upon thermal resistance RθJB.