ZHCSUT0D October 2001 – February 2024 TFP410
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
-
6 Detailed Description
- 6.1 Overview
- 6.2 Functional Block Diagram
- 6.3 Feature Description
- 6.4 Device Functional Modes
- 6.5 Programming
- 6.6
Register Maps
- 6.6.1 VEN_ID Register (Sub-Address = 01?00 ) [reset = 0x014C]
- 6.6.2 DEV_ID Register (Sub-Address = 03–02) [reset = 0x0410]
- 6.6.3 REV_ID Register (Sub-Address = 04) [reset = 0x00]
- 6.6.4 Reserved Register (Sub-Address = 07–05) [reset = 0x641400]
- 6.6.5 CTL_1_MODE (Sub-Address = 08) [reset = 0xBE]
- 6.6.6 CTL_2_MODE Register (Sub-Address = 09) [reset = 0x00]
- 6.6.7 CTL_3_MODE Register (Sub-Address = 0A) [reset = 0x80]
- 6.6.8 CFG Register (Sub-Address = 0B)
- 6.6.9 RESERVED Register (Sub-Address = 0E–0C) [reset = 0x97D0A9]
- 6.6.10 DE_DLY Register (Sub-Address = 32) [reset = 0x00]
- 6.6.11 DE_CTL Register (Sub-Address = 33) [reset = 0x00]
- 6.6.12 DE_TOP Register (Sub-Address = 34) [reset = 0x00]
- 6.6.13 DE_CNT Register (Sub-Address = 37–36) [reset = 0x0000]
- 6.6.14 DE_LIN Register (Sub-Address = 39–38) [reset = 0x0000]
- 6.6.15 H_RES Register (Sub-Address = 3B?3A)
- 6.6.16 V_RES Register (Sub-Address = 3D?3C)
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機械數(shù)據(jù) (封裝 | 引腳)
- PAP|64
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- PAP|64
訂購信息
7.2.2.3 Power Supplies Decoupling
Digital, analog, and PLL supplies must be decoupled from each other to avoid electrical noise on the PLL and the core.
Figure 7-3 Power Decoupling