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ZHCS616E March 2012 – February 2017 TCA9554

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

DW|16
- MSOI003I
PW|16
- MPDS361B
DBQ|16
- MSOI004H
DB|16
- MPDS507A

散熱焊盤機械數據 (封裝 | 引腳)

DW|16
- QFND313D

訂購信息

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS		V_CC	MIN	TYP⁽¹⁾	MAX	UNIT
V_IK	Input diode clamp voltage	I_I = –18 mA		1.65 V to 5.5 V	–1.2			V
V_PORR	Power-on reset voltage, V_CC rising	V_I = V_CC or GND, I_O = 0				1.2	1.5	V
V_PORF	Power-on reset voltage, V_CC falling	V_I = V_CC or GND, I_O = 0			0.75	1		V
V_OH	P-port high-level output voltage⁽²⁾	I_OH = –8 mA		1.65 V	1.2			V
				2.3 V	1.8			V
				3 V	2.6
				4.5 V	4.1
		I_OH = –10 mA		1.65 V	1.1
				2.3 V	1.7
				3 V	2.5
				4.5 V	4
I_OL	SDA⁽⁴⁾	V_OL = 0.4 V		1.65 V to 5.5 V	3	11		mA
	P port⁽³⁾	V_OL = 0.5 V		1.65 V	8	10
				2.3 V	8	13
				3 V	8	15
				4.5 V	8	17
		V_OL = 0.7 V		1.65 V	10	14
				2.3 V	10	17
				3 V	10	20
				4.5 V	10	24
	INT⁽⁵⁾	V_OL = 0.4 V		1.65 V to 5.5 V	3	7
I_I	SCL, SDA	V_I = V_CC or GND		1.65 V to 5.5 V			±1	µA
I_I	A0, A1, A2	V_I = V_CC or GND		1.65 V to 5.5 V			±1	µA
I_IH	P port	V_I = V_CC		1.65 V to 5.5 V			1	µA
I_IL	P port	V_I = GND		1.65 V to 5.5 V			–100	µA
I_CC	Operating mode	V_I = V_CC or GND, I_O = 0, I/O = inputs, f_SCL = 400 kHz, no load, t_r,max = 300 ns		5.5 V		34		µA
				3.6 V		15
				2.7 V		9
				1.65 V		5
	Standby mode	I/O = inputs, f_SCL = 0 kHz	V_I = V_CC	5.5 V		1.9	3.5
				3.6 V		1.1	1.8
				2.7 V		1	1.6
				1.95 V		0.4	1
			V_I = GND	5.5 V		0.45	0.7	mA
				3.6 V		0.3	0.6
				2.7 V		0.23	0.5
				1.95 V		0.23	0.5
C_i	SCL	V_I = V_CC or GND		1.65 V to 5.5 V		3	8	pF
C_io	SDA	V_IO = V_CC or GND		1.65 V to 5.5 V		5.5	9.5	pF
C_io	P port	V_IO = V_CC or GND		1.65 V to 5.5 V		8	9.5	pF

(1) All typical values are at nominal supply voltage (1.8-, 2.5-, 3.3-, or 5-V V_CC) and T_A = 25°C.

(2) Each P-port I/O configured as a high output must be externally limited to a maximum of 10 mA, and the total current sourced by all I/Os (P-ports P7-P0) through V_CC must be limited to a maximum current of 80 mA.

(3) Each P-port I/O configured as a low output must be externally limited to a maximum of 25 mA, and the total current sunk by all I/Os (P-ports P7-P0, INT, and SDA) through GND must be limited to a maximum current of 200 mA.

(4) The SDA pin must be externally limited to a maximum of 12 mA, and the total current sunk by all I/Os (P-ports P7-P0, INT, and SDA) through GND must be limited to a maximum current of 200 mA.

(5) The INT pin must be externally limited to a maximum of 7 mA, and the total current sunk by all I/Os (P-ports P7-P0, INT, and SDA) through GND must be limited to a maximum current of 200 mA.