4 Revision History
Changes from O Revision (December 2013) to P Revision
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Added Applications section, Device Information table, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
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Changed Package thermal impedance, RθJA, values From: 165°C/W To: 223°C/W (DBV), From: 259°C/W To: 271.7°C/W (DCK), From: 142°C/W To: 252.5°C/W (DRL), and From: 123°C/W To: 124°C/W (YZP)Go
Changes from N Revision (April 2013) to O Revision
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Changed Ioff in FeaturesGo
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Changed Operating temperature rangeGo
Changes from M Revision (October 2011) to N Revision
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Removed Ordering Information table; package updates now included in Package Ordering AddendumGo
Changes from L Revision (January 2007) to M Revision
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Added additional package options to the Ordering Information tableGo
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Added DRY and DSF packages to data sheetGo