ZHCSND7 September 2022 SN6507-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | SN6507 | UNIT | |
|---|---|---|---|
| DGQ (HVSSOP) | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 48.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 61.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 18.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 18.3 | °C/W |
| RθJC(bottom) | Junction-to-case(bottom) thermal resistance | 5.8 | °C/W |