10 Revision History
Changes from Revision D (December 2024) to Revision E (December 2024)
- 將整個數據表中的 VSSOP (DSG) 封裝更改為 VSSOP (DGS) 封裝Go
Changes from Revision C (January 2023) to Revision D (December 2024)
- 將器件信息 表更改為封裝信息 表Go
- 向數據表中添加了 VSSOP (DSG) 封裝Go
- Added Note 2 to the ESD Ratings, IEC Specifications
Go
Changes from Revision B (August 2021) to Revision C (January 2023)
- Changed the ESD Ratings - IEC Specifications table note to include the DB packageGo
- Changed the values of R θJA in the Thermal Information table for the DB packageGo
Changes from Revision A (September 2009) to Revision B (August 2021)
- 更新了應用 部分的列表。Go
- 刪除了訂購信息 表Go
- 添加了器件信息 表、引腳配置和功能、詳細說明 部分、應用和實施 部分Go
- Deleted the Package thermal impedance from the Absolute Maximum
Ratings
Go
- Changed the ESD Ratings tableGo
- Added the ESD Ratings - IEC Specifications tableGo
- Added the Thermal Information tableGo
- Changed the value of R θJA for PW package (previously in the Absolute Maximum Ratings table), and added additional thermal parameters for all packages in the Thermal Information table.Go