ZHCSOM1K April 2006 – December 2024 LP2950 , LP2951
PRODUCTION DATA
| THERMAL METRIC(1)(2) | Legacy Chip | New Chip | UNIT | |||||
|---|---|---|---|---|---|---|---|---|
| D | DRG | LP | D | DRG | LP | |||
| 8 PINS | 8 PINS | 3 PINS | 8 PINS | 8 PINS | 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 97 | 52.44 | 140 | 123 | 48.5 | 132.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | - | - | - | 67.8 | 60.4 | 114.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | - | - | - | 70.7 | 22.4 | 94.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | - | - | - | 18.0 | 1.7 | 26.9 | °C/W |
| ΨJB | Junction-to-board characterization parameter | - | - | - | 69.8 | 22.4 | 94.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | - | n/a | 3.3 | n/a | °C/W |