ZHCSO70A march 2023 – may 2023 LMR36501 , LMR36502
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Enable, Shutdown, and Start-up
- 8.3.2 Adjustable Switching Frequency (with RT)
- 8.3.3 Power-Good Output Operation
- 8.3.4 Internal LDO, VCC UVLO, and VOUT/FB Input
- 8.3.5 Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
- 8.3.6 Output Voltage Selection
- 8.3.7 Soft Start and Recovery from Dropout
- 8.3.8 Current Limit and Short Circuit
- 8.3.9 Thermal Shutdown
- 8.3.10 Input Supply Current
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2 Detailed Design Procedure
- 9.2.3 Application Curves
- 9.3 Best Design Practices
- 9.4 Power Supply Recommendations
- 9.5 Layout
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- RPE|9
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- RPE|9
訂購信息
10.6 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細微的參數(shù)更改都可能會導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |