ZHCSKF5C October 2019 – November 2020 LMR33640
PRODUCTION DATA
| THERMAL METRIC(1)(2) | LMR33640 | UNIT | |
|---|---|---|---|
| DDA (HSOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 42.9(2) | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 54 | °C/W |
| RθJB | Junction-to-board thermal resistance | 13.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 4.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 13.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.3 | °C/W |