ZHCSIE8C June 2018 – October 2020 LMR33630-Q1
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1)(2) | LMR336x0 | UNIT | |
|---|---|---|---|
| RNX (VQFN) | |||
| 12 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 72.5(2) | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 35.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 23.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 23.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |