ZHCSF93E December 2015 – August 2020 LMR23630
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Fixed Frequency Peak Current Mode Control
- 8.3.2 Adjustable Frequency
- 8.3.3 Adjustable Output Voltage
- 8.3.4 Enable/Sync
- 8.3.5 VCC, UVLO
- 8.3.6 Minimum ON-time, Minimum OFF-time and Frequency Foldback at Dropout Conditions
- 8.3.7 Power Good (PGOOD)
- 8.3.8 Internal Compensation and CFF
- 8.3.9 Bootstrap Voltage (BOOT)
- 8.3.10 Overcurrent and Short-Circuit Protection
- 8.3.11 Thermal Shutdown
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Applications
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Custom Design With WEBENCH? Tools
- 9.2.2.2 Output Voltage Setpoint
- 9.2.2.3 Switching Frequency
- 9.2.2.4 Inductor Selection
- 9.2.2.5 Output Capacitor Selection
- 9.2.2.6 Feed-Forward Capacitor
- 9.2.2.7 Input Capacitor Selection
- 9.2.2.8 Bootstrap Capacitor Selection
- 9.2.2.9 VCC Capacitor Selection
- 9.2.2.10 Undervoltage Lockout Setpoint
- 9.2.3 Application Curves
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- DRR|12
- DDA|8
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
9.2 Typical Applications
The LMR23630 only requires a few external components to convert from a wide voltage-range supply to a fixed output voltage. Figure 9-1 shows a basic schematic.
Figure 9-1 LM23630 Application CircuitThe external components must fulfill the needs of the application, but also the stability criteria of the device control loop. Table 9-1 can be used to simplify the output filter component selection.
Table 9-1 L, COUT, and CFF Typical Values
| fSW (kHz) | VOUT (V) | L (μH) (2) | COUT (μF) (3) | CFF (pF) | RFBT (kΩ)(4)(5) |
|---|---|---|---|---|---|
| 200 | 3.3 | 15 | 300 | 150 | 51 |
| 5 | 18 | 200 | 100 | 88.7 | |
| 12 | 33 | 100 | See(1) | 243 | |
| 24 | 33 | 47 | See(1) | 510 | |
| 400 | 3.3 | 6.8 | 150 | 75 | 51 |
| 5 | 10 | 100 | 47 | 88.7 | |
| 12 | 15 | 68 | See(1) | 243 | |
| 24 | 15 | 47 | See(1) | 510 | |
| 1000 | 3.3 | 3.3 | 68 | 39 | 51 |
| 5 | 4.7 | 47 | 25 | 88.7 | |
| 2200 | 3.3 | 2.2 | 47 | 33 | 51 |
| 5 | 2.2 | 33 | 18 | 88.7 |
(1) High ESR COUT gives enough phase boost and CFF not needed.
(2) Inductance value is calculated based on VIN = 36 V.
(3) All the COUT values are after derating. Add more when using ceramic capacitors.
(4) RFBT = 0 Ω for VOUT = 1 V. RFBB = 22.1 kΩ for all other VOUT setting.
(5) For designs with RFBT other than recommended value, please adjust CFF such that (CFF × RFBT) is unchanged and adjust RFBB such that (RFBT / RFBB) is unchanged.