ZHCSF93E December 2015 – August 2020 LMR23630
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC (1) (2) | DDA (8 PINS) | DRR (12 PINS) | UNIT | |
|---|---|---|---|---|
| RθJA | Junction-to-ambient thermal resistance | 42.0 | 41.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 5.9 | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 23.4 | 16.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 45.8 | 39.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.6 | 3.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 23.4 | 16.3 | °C/W |