ZHCSF93E December 2015 – August 2020 LMR23630
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Fixed Frequency Peak Current Mode Control
- 8.3.2 Adjustable Frequency
- 8.3.3 Adjustable Output Voltage
- 8.3.4 Enable/Sync
- 8.3.5 VCC, UVLO
- 8.3.6 Minimum ON-time, Minimum OFF-time and Frequency Foldback at Dropout Conditions
- 8.3.7 Power Good (PGOOD)
- 8.3.8 Internal Compensation and CFF
- 8.3.9 Bootstrap Voltage (BOOT)
- 8.3.10 Overcurrent and Short-Circuit Protection
- 8.3.11 Thermal Shutdown
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Applications
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Custom Design With WEBENCH? Tools
- 9.2.2.2 Output Voltage Setpoint
- 9.2.2.3 Switching Frequency
- 9.2.2.4 Inductor Selection
- 9.2.2.5 Output Capacitor Selection
- 9.2.2.6 Feed-Forward Capacitor
- 9.2.2.7 Input Capacitor Selection
- 9.2.2.8 Bootstrap Capacitor Selection
- 9.2.2.9 VCC Capacitor Selection
- 9.2.2.10 Undervoltage Lockout Setpoint
- 9.2.3 Application Curves
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DRR|12
- DDA|8
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
12.5 靜電放電警告
 |
靜電放電 (ESD) 會(huì)損壞這個(gè)集成電路。德州儀器 (TI) 建議通過(guò)適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會(huì)損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級(jí)，大至整個(gè)器件故障。精密的集成電路可能更容易受到損壞，這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |