ZHCSJX4B June 2012 – June 2019 LMR10530
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Layout
- 10器件和文檔支持
- 11機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSC|10
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSC|10
訂購(gòu)信息
5 Pin Configuration and Functions
DSC Package
10-Pin WSON
Top View
Pin Descriptions
| PIN | DESCRIPTION | |
|---|---|---|
| NO. | NAME | |
| 1 | VINC | Input supply for internal bias and control circuitry. Need to locally bypass this pin to GND. |
| 2 | EN | Enable control input. Logic high enables operation. Do not allow this pin to float or subject to voltages greater than VIN + 0.3V. |
| 3 | SGND | Signal (analog) ground. Place the bottom resistor of the feedback network as close as possible to this pin for good load regulation. |
| 4 | NC | No user function, connect this pin to GND. |
| 5 | FB | Feedback pin. Connect this pin to the external resistor divider to set output voltage. |
| 6 | PGND | Power ground pin. Provides ground return path for the internal driver. |
| 7, 8 | SW | Switch pins. Connect these pins to the inductor and catch diode. |
| 9, 10 | VIND | Input supply voltage. Connect a bypass capacitor locally from these pins to PGND. |
| DAP | Die Attach Pad | Connect to system ground for low thermal impedance, but it cannot be used as a primary GND connection. |