ZHCSH86B December   2017  – February 2019 LMH5401-SP

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
   1.     Device Images
      1.      LMH5401-SP 小信號(hào)頻率響應(yīng)
      2.      LMH5401-SP 驅(qū)動(dòng) ADC12D1620QML
4. 4 修訂歷史記錄
5. 5 說(shuō)明 （續(xù)）
6. 6 Pin Configuration and Functions
   1.     Pin Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics: VS = 5 V
   6. 7.6 Electrical Characteristics: VS = 3.3 V
   7. 7.7 Typical Characteristics: 5 V
   8. 7.8 Typical Characteristics: 3.3 V
8. 8 Parameter Measurement Information
   1. 8.1  Output Reference Nodes and Gain Nomenclature
   2. 8.2  ATE Testing and DC Measurements
   3. 8.3  Frequency Response
   4. 8.4  S-Parameters
   5. 8.5  Frequency Response with Capacitive Load
   6. 8.6  Distortion
   7. 8.7  Noise Figure
   8. 8.8  Pulse Response, Slew Rate, and Overdrive Recovery
   9. 8.9  Power Down
   10. 8.10 VCM Frequency Response
   11. 8.11 Test Schematics
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Fully-Differential Amplifier
      2. 9.3.2 Operations for Single-Ended to Differential Signals
         1. 9.3.2.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
         2. 9.3.2.2 DC-Coupled Input Signal Path Considerations for SE-DE Conversions
         3. 9.3.2.3 Resistor Design Equations for Single-to-Differential Applications
         4. 9.3.2.4 Input Impedance Calculations
      3. 9.3.3 Differential-to-Differential Signals
         1. 9.3.3.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
         2. 9.3.3.2 DC-Coupled, Differential-Input to Differential-Output Design Issues
      4. 9.3.4 Output Common-Mode Voltage
   4. 9.4 Device Functional Modes
      1. 9.4.1 Operation With a Split Supply
      2. 9.4.2 Operation With a Single Supply
10. 10Application and Implementation
    1. 10.1 Application Information
       1. 10.1.1 Stability, Noise Gain, and Signal Gain
       2. 10.1.2 Input and Output Headroom Considerations
       3. 10.1.3 Noise Analysis
       4. 10.1.4 Noise Figure
       5. 10.1.5 Thermal Considerations
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
          1. 10.2.2.1 Driving Matched Loads
          2. 10.2.2.2 Driving Unmatched Loads For Lower Loss
          3. 10.2.2.3 Driving Capacitive Loads
          4. 10.2.2.4 Driving ADCs
             1. 10.2.2.4.1 SNR Considerations
             2. 10.2.2.4.2 SFDR Considerations
             3. 10.2.2.4.3 ADC Input Common-Mode Voltage Considerations—AC-Coupled Input
             4. 10.2.2.4.4 ADC Input Common-Mode Voltage Considerations—DC-Coupled Input
          5. 10.2.2.5 GSPS ADC Driver
          6. 10.2.2.6 Common-Mode Voltage Correction
          7. 10.2.2.7 Active Balun
       3. 10.2.3 Application Curves
    3. 10.3 Do's and Don'ts
       1. 10.3.1 Do:
       2. 10.3.2 Don't:
11. 11Power Supply Recommendations
    1. 11.1 Supply Voltage
    2. 11.2 Single Supply
    3. 11.3 Split Supply
    4. 11.4 Supply Decoupling
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13器件和文檔支持
    1. 13.1 器件支持
       1. 13.1.1 器件命名規(guī)則
    2. 13.2 文檔支持
       1. 13.2.1 相關(guān)文檔
    3. 13.3 接收文檔更新通知
    4. 13.4 社區(qū)資源
    5. 13.5 商標(biāo)
    6. 13.6 靜電放電警告
    7. 13.7 術(shù)語(yǔ)表
14. 14機(jī)械、封裝和可訂購(gòu)信息