ZHCSKE0B March   2017  – October 2019 LMH1208

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
   1.     簡化方框圖
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Recommended SMBus Interface Timing Specifications
   7. 6.7 Serial Parallel Interface (SPI) Timing Specifications
   8. 6.8 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 4-Level Input Pins and Thresholds
      2. 7.3.2 OUT0_SEL and SDI_OUT2_SEL Control
      3. 7.3.3 Input Signal Detect
      4. 7.3.4 Continuous Time Linear Equalizer (CTLE)
      5. 7.3.5 Output Driver Control
         1. 7.3.5.1 Line-Side Output Cable Driver (SDI_OUT1+, SDI_OUT2+)
            1. 7.3.5.1.1 Output Amplitude (VOD)
            2. 7.3.5.1.2 Output Pre-Emphasis
            3. 7.3.5.1.3 Output Slew Rate
            4. 7.3.5.1.4 Output Polarity Inversion
         2. 7.3.5.2 Host-Side 100-Ω Output Driver (OUT0±)
      6. 7.3.6 Status Indicators and Interrupts
         1. 7.3.6.1 SD_N (Signal Detect)
         2. 7.3.6.2 INT_N (Interrupt)
   4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
         1. 7.4.1.1 SMBus Read and Write Transaction
            1. 7.4.1.1.1 SMBus Write Operation Format
            2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
         1. 7.4.2.1 SPI Read and Write Transactions
         2. 7.4.2.2 SPI Write Transaction Format
         3. 7.4.2.3 SPI Read Transaction Format
         4. 7.4.2.4 SPI Daisy Chain
   5. 7.5 Register Maps
8. 8 Application and Implementation
   1. 8.1 Application Information
      1. 8.1.1 SMPTE Requirements and Specifications
      2. 8.1.2 LMH1208 and LMH1228 Compatibility
   2. 8.2 Typical Applications
      1. 8.2.1 Dual Cable Driver
         1. 8.2.1.1 Design Requirements
         2. 8.2.1.2 Detailed Design Procedure
         3. 8.2.1.3 Application Curves
      2. 8.2.2 Distribution Amplifier
         1. 8.2.2.1 Design Requirements
         2. 8.2.2.2 Detailed Design Procedure
         3. 8.2.2.3 Application Curves
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 Board Stack-Up and Ground References
       2. 10.1.2 High-Speed PCB Trace Routing and Coupling
       3. 10.1.3 Anti-Pads
       4. 10.1.4 BNC Connector Layout and Routing
       5. 10.1.5 Power Supply and Ground Connections
       6. 10.1.6 Footprint Recommendations
    2. 10.2 Layout Example
11. 11器件和文檔支持
    1. 11.1 文檔支持
       1. 11.1.1 相關(guān)文檔
    2. 11.2 接收文檔更新通知
    3. 11.3 社區(qū)資源
    4. 11.4 商標(biāo)
    5. 11.5 靜電放電警告
    6. 11.6 出口管制提示
    7. 11.7 Glossary
12. 12機(jī)械、封裝和可訂購信息
    1. 12.1 Package Option Addendum
       1. 12.1.1 Packaging Information
       2. 12.1.2 Tape and Reel Information