SNOSDF9B July 2023 – March 2024 LMG2100R044
PRODUCTION DATA
| THERMAL METRIC (1) | LMG2100 | UNIT | |
|---|---|---|---|
| QFN | |||
| 9 PINS | |||
| R θJA | Junction-to-ambient thermal resistance | 29 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | 0.7 | |
| R θJB | Junction-to-board thermal resistance | 6.2 | °C/W |
| ψ JT | Junction-to-top characterization parameter | 2.8 | °C/W |
| ψ JB | Junction-to-board characterization parameter | 5.5 | °C/W |