8 Revision History
Changes from Revision J (January 2015) to Revision K (February 2026)
- Removed (VS = 5 V, TA = 25°C, typical values
unless specified) Go
- Removed ±5% settling time 400 ns (500 pF, 100 mVPP
step)Go
- Updated GBWP from 21MHz to 24MHzGo
- Updated Wide supply voltage range from 2.5V to 2.7V and from 30V to
32VGo
- Updated Slew rate from 12V/μs to 35V/μsGo
- Updated Supply current from 0.97mA to 1.35mAGo
- Updated Output short circuit current from 53 mA/ ?75 mA to
±125mAGo
- Updated Input Voltage Noise from 15nV/ √
Hz
to 12nV/ √
Hz
Go
- Updated THD+N from <0.05% to < 0.00022%Go
- Updated the numbering format for tables, figures, and
cross-references throughout the documentGo
- Updated the description as per new die.Go
- Updated Table and Footnotes as per new die
specificationsGo
- Updated Electrostatic discharge value for CDM from ±200V to
±1500VGo
- Updated footnotesGo
- Updated Supply Voltage minimum from 2.5V to 2.7V and maximum from
30V to 32VGo
- Updated Junction-to-ambient thermal resistance from 325°C/W to
185.4°C/WGo
- Changed Electrical characteristics from ±15V to
±16V.Go
- Updated Table descriptionGo
- Updated Input offset voltage test conditions to VCM
=V–
Go
- Removed Input bias current test conditions for VCM =14.5
V and curresponding value for range ?40°C ≤ TA ≤
+125°CGo
- Removed Input Offest current test conditions for VCM
=±14.5 V and corresponding value for range ?40°C ≤ TA ≤
+125°CGo
- Updated Common Mode Rejection Ratio test conditions from
VCM stepped from ?15 V to 13 V to V– <
VCM < (V+) – 2V and from ?65°C ≤ TJ ≤
+150°C to ?40°C ≤ TA ≤ +125°CGo
- Removed Common Mode Rejection Ratio test conditions and
corresponding values for VCM stepped from 14V to 15V and for
VCM stepped from ?15V to 15VGo
- Updated Power Supply Rejection Ratio test conditions from
V+ = ±12V to ±15V to VCM= V–, VS
= 5V to 32V and from ?65°C ≤ TJ ≤ +150°C to ?40°C ≤ TA ≤
+125°CGo
- Updated Power Supply Rejection Ratio typical value from 100dB to
±3.5μV/V and maximum value from 70dB to ±22μV/V Go
- Removed Negative Power Supply Rejection RatioGo
- Removed CMVR valuesGo
- Updated VCM value minimum V? and maximum
V+
Go
- Updated Open Loop Voltage Gain typical value 85dBGo
- Removed Large Signal Voltage GainGo
- Removed Output swing highGo
- Updated Voltage Output Swing from Rail for RL=10kΩ from
14.83V to 15.94VGo
- Updated Voltage Output Swing from Rail for RL=2kΩ from
14.73V to 15.8VGo
- Updated Voltage Output Swing from Rail for RL=10kΩ from
?14.91V to ?15.94VGo
- Updated Voltage Output Swing from Rail for RL=2kΩ from
?14.83V to ?15.8VGo
- Updated Output Short Circuit Current from 60mA to 125mA typical and
maximum from 40mA to ±62mA.Go
- Removed all test conditions for Output Short Circuit Current Go
- Updated Supply Current maximum from 1.50mA to 1.93mA and 1.90mA to
2.23mA Go
- Updated Slew Rate from 15V/μs to 35V/μs Go
- Removed Unity Gain FrequencyGo
- Removed Gain Bandwidth maximum valueGo
- Updated Phase margin typical value from 58° to 50°Go
- Updated Input Voltage Noise Density typical value from 15nV/ √
hZ to 12nV/ √ hZ
Go
- Removed Full Power BandwidthGo
- Updated Settling time typical value from 320ns to
430nsGo
- Updated Total Harmonic Distortion +Noise from 0.01% to
113dBGo
- Updated Open-Loop Gain and Phase vs Frequency plotGo
- Updated Closed-Loop Gain vs Frequency plotGo
- Updated Input Bias Current and Offset Current vs Common-Mode Voltage
plotGo
- Updated Output Voltage Swing vs Output Current (Sourcing)
plotGo
- Updated Output Voltage Swing vs Output Current (Sinking)
plotGo
- Updated Input Voltage Noise Spectral Density vs Frequency
plotGo
- Updated THD+N Ratio vs Frequency plotGo
- Updated THD+N vs Output Amplitude plotGo
- Updated Open-Loop Output Impedance vs Frequency plot Go
- Updated Small-Signal Overshoot vs Capacitive Load plot Go
- Added Old Versus New Die Comparison
Go
- Removed Block diagram and operational descriptionGo
- Removed Estimating the Output Voltage Swing
sectionGo
- Removed TFT Application sectionGo
- Added Low-Side Current Measurement sectionGo
- Removed LM8261 Advantages sectionGo
- Updated guidelines as per new dieGo
- Removed Layout Example sectionGo
Changes from Revision I (March 2013) to Revision J (January 2015)
- Added, updated, or revised the following sections: Pin
Configuration and Functions, Specifications, Detailed
Description , Application and Implementation, Power Supply
Recommendations , Layout , Device and Documentation
Support , and Mechanical, Packaging, and Orderable Information
section Go
- Changed from -1.0 V to -0.8 V in
Section 5
Go
Changes from Revision H (March 2013) to Revision I (March 2013)
- Changed layout of National Data Sheet to TI formatGo