| THERMAL METRIC(1)(2) | DBV | UNIT |
|---|
| (5 PINS) |
|---|
| RθJA | Junction-to-ambient thermal resistance | 185.4 | °C/W |
(1) For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics application report,
SPRA953.
(2) The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.