ZHCSKV1A February 2020 – July 2020 LM76005
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Fixed-Frequency, Peak-Current-Mode Control
- 7.3.2 Light Load Operation Modes — PFM and FPWM
- 7.3.3 Adjustable Output Voltage
- 7.3.4 Enable (EN Pin) and UVLO
- 7.3.5 Internal LDO, VCC UVLO, and Bias Input
- 7.3.6 Soft Start and Voltage Tracking (SS/TRK)
- 7.3.7 Adjustable Switching Frequency (RT) and Frequency Synchronization
- 7.3.8 Minimum On-Time, Minimum Off-Time, and Frequency Foldback at Dropout Conditions
- 7.3.9 Bootstrap Voltage and VBOOT UVLO (BOOT Pin)
- 7.3.10 Power Good and Overvoltage Protection (PGOOD)
- 7.3.11 Overcurrent and Short-Circuit Protection
- 7.3.12 Thermal Shutdown
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Applications
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Custom Design With WEBENCH? Tools
- 8.2.2.2 Output Voltage Setpoint
- 8.2.2.3 Switching Frequency
- 8.2.2.4 Input Capacitors
- 8.2.2.5 Inductor Selection
- 8.2.2.6 Output Capacitor Selection
- 8.2.2.7 Feedforward Capacitor
- 8.2.2.8 Bootstrap Capacitors
- 8.2.2.9 VCC Capacitors
- 8.2.2.10 BIAS Capacitors
- 8.2.2.11 Soft-Start Capacitors
- 8.2.2.12 Undervoltage Lockout Setpoint
- 8.2.2.13 PGOOD
- 8.2.2.14 Synchronization
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
11.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |