ZHCSH35B November 2017 – May 2021 LM73605-Q1 , LM73606-Q1
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Device Comparison
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Synchronous Step-Down Regulator
- 8.3.2 Auto Mode and FPWM Mode
- 8.3.3 Fixed-Frequency Peak Current-Mode Control
- 8.3.4 Adjustable Output Voltage
- 8.3.5 Enable and UVLO
- 8.3.6 Internal LDO, VCC_UVLO, and BIAS Input
- 8.3.7 Soft Start and Voltage Tracking
- 8.3.8 Adjustable Switching Frequency
- 8.3.9 Frequency Synchronization and Mode Setting
- 8.3.10 Internal Compensation and CFF
- 8.3.11 Bootstrap Capacitor and VBOOT-UVLO
- 8.3.12 Power-Good and Overvoltage Protection
- 8.3.13 Overcurrent and Short-Circuit Protection
- 8.3.14 Thermal Shutdown
- 8.4 Device Functional Modes
- 9 Layout
- 10Device and Documentation Support
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RNP|30
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RNP|30
訂購(gòu)信息
10.8 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |