ZHCSM29A September 2023 – June 2024 LM70840-Q1 , LM70860-Q1 , LM70880-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LM708x0-Q1 | UNIT | ||
|---|---|---|---|---|
| JESD 51-7 | LM70880QEVM | |||
| 29 PINS | 29 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 33.5(2) | 18.6(3) | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 31.6 | (4) | °C/W |
| RθJB | Junction-to-board thermal resistance | 11.7 | (4) | °C/W |
| ψJT | Junction-to-top characterization parameter (Tcase-center) | 11.5 | 7.2 | °C/W |
| ψJT | Junction-to-top characterization parameter (Tcase-max) | – | 0.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 11.6 | 6.3 | °C/W |