ZHCSN09A June 2021 – September 2022 LM5168-Q1 , LM5169-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LM516x-Q1 | UNIT | |
|---|---|---|---|
| DDA (SOIC) | |||
| 8 PINS | |||
| RθJA(EVM) | Junction-to-ambient thermal resistance for LM5168PEVM(2) | 22 | °C/W |
| RθJA | Junction-to-ambient thermal resistance | 38.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 51.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 2.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 14.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 14.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.3 | °C/W |