ZHCSMX3C December 2020 – February 2023 LM5149-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | RGY (VQFN) | UNIT | |
|---|---|---|---|
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 37.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 32 | |
| RθJB | Junction-to-board thermal resistance | 15.5 | |
| ΨJT | Junction-to-top characterization parameter | 1.2 | |
| ΨJB | Junction-to-board characterization parameter | 15.5 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 5.6 | |