ZHCSGO2H September 2003 – November 2018 LM5007
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Custom Design With WEBENCH® Tools
- 8.2.2.2 Custom Design With Excel Quickstart Tool
- 8.2.2.3 Feedback Resistors, RFB1 and RFB2
- 8.2.2.4 Switching Frequency Selection, RON
- 8.2.2.5 Buck Inductor, L1
- 8.2.2.6 Output Capacitor, COUT
- 8.2.2.7 Type I Ripple Circuit, RC
- 8.2.2.8 Input Capacitor, CIN
- 8.2.2.9 Current Limit, RCL
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
11.5 靜電放電警告
這些裝置包含有限的內(nèi)置 ESD 保護(hù)。 存儲(chǔ)或裝卸時(shí)，應(yīng)將導(dǎo)線一起截短或?qū)⒀b置放置于導(dǎo)電泡棉中，以防止 MOS 門極遭受靜電損傷。