ZHCSOZ8A april 2023 – august 2023 LM2103
PRODUCTION DATA
| THERMAL METRIC(1) | LM2103 | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 133.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 75.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 76.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 25.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 75.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |