ZHCSQR7A October 2023 – June 2024 ISOTMP35
PRODUCTION DATA
| THERMAL METRIC(1) | ISOTMP35 | UNIT | |
|---|---|---|---|
| DFQ (SOIC) | |||
| 7 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 116.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 62.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 38.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 41.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 38.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | N/A | °C/W |
| MT | Thermal Mass | 51.0 | mJ/°C |