ZHCSD31H November 2014 – November 2024 ISO7821
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | ISO7821 | UNIT | |||
|---|---|---|---|---|---|
| DW (SOIC) | DWW (SOIC) | ||||
| 16 PINS | 16-PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 84.7 | 84.7 | °C/W | |
| RθJC(top) | Junction-to-case(top) thermal resistance | 47.3 | 46.0 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 49.4 | 54.5 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 19.1 | 18.5 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 48.8 | 53.8 | °C/W | |
| RθJC(bottom) | Junction-to-case(bottom) thermal resistance | n/a | n/a | °C/W | |