ZHCSFU6F November 2016 – October 2024 ISO7730-Q1 , ISO7731-Q1
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | ISO773x | UNIT | ||
|---|---|---|---|---|
| DW (SOIC) | DBQ (QSOP) | |||
| 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 81.4 | 109 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 44.9 | 46.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 45.9 | 60.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 28.1 | 35.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 45.5 | 60 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | °C/W |