ZHCSG31C March 2017 – December 2024 ISO7710-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Absolute Maximum Ratings
- 7 ESD Ratings
- 8 Recommended Operating Conditions
- 9 Thermal Information
- 10Power Ratings
- 11Insulation Specifications
- 12Safety-Related Certifications
- 13Safety Limiting Values
- 14Electrical Characteristics—5-V Supply
- 15Supply Current Characteristics—5-V Supply
- 16Electrical Characteristics—3.3-V Supply
- 17Supply Current Characteristics—3.3-V Supply
- 18Electrical Characteristics—2.5-V Supply?
- 19Supply Current Characteristics—2.5-V Supply
- 20Switching Characteristics—5-V Supply
- 21Switching Characteristics—3.3-V Supply
- 22Switching Characteristics—2.5-V Supply
- 23Parameter Measurement Information
- 24Detailed Description
- 25Application and Implementation
- 26Device and Documentation Support
- 27Revision History
- 28Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DW|16
訂購(gòu)信息
26.6 靜電放電警告
 |
靜電放電 (ESD) 會(huì)損壞這個(gè)集成電路。德州儀器 (TI) 建議通過(guò)適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會(huì)損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級(jí)，大至整個(gè)器件故障。精密的集成電路可能更容易受到損壞，這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |