ZHCS193B September 2011 – February 2025 ISO7231C-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
-
4 Specifications
- 4.1 Absolute Maximum Ratings
- 4.2 ESD Ratings
- 4.3 Recommended Operating Conditions
- 4.4 Thermal Characteristics
- 4.5 Power Ratings
- 4.6 Insulation Specifications
- 4.7 Safety-Related Certifications
- 4.8 Safety Limiting Values
- 4.9 Electrical Characteristics: VCC1 and VCC2 at 3.3 V Operation
- 4.10 Electrical Characteristics: VCC1 and VCC2 at 5-V Operation
- 4.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
- 4.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
- 4.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V Operation
- 4.14 Switching Characteristics: VCC1 and VCC2 at 5-V Operation
- 4.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V Operation
- 4.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
- 4.17 Typical Characteristics
- 5 Parameter Measurement Information
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
8.5 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當的預防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細微的參數更改都可能會導致器件與其發布的規格不相符。 |