VCC1 = 5.5 V, VCC2 = 30 V, TA = 25°C| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
|---|
| PD | Maximum power dissipation(1) | | | | 1255 | mW |
| PID | Maximum input power dissipation | | | | 175 | mW |
| POD | Maximum output power dissipation | | | | 1080 | mW |
(1) Full chip power dissipation is derated 10.04 mW/°C beyond 25°C ambient temperature. At 125°C ambient temperature, a maximum of 251 mW total power dissipation is allowed. Power dissipation can be optimized depending on ambient temperature and board design, while ensuring that Junction temperature does not exceed 150°C.