ZHCSGK5B July 2017 – August 2024 ESD401
PRODUCTION DATA
| THERMAL METRIC(1) | ESD401 | UNIT | |
|---|---|---|---|
| DPY (X1SON) | |||
| 2 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 420 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 169.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 276.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 122.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 157.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |