ZHCSHL9A February 2018 – March 2018 ESD224
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Setup
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DQA|10
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DQA|10
訂購信息
6.7 Typical Characteristics
Figure 1. Positive TLP Curve, Connector side IO Pin to GND (tp=100ns) 
Figure 3. Clamping voltage waveform for +8kV IEC 61000-4-2 stress. See Figure 11 for details. 
Figure 5. IEC 61000-4-5 Surge Waveform (tp=8/20 µs) 
Figure 7. DC Voltage Sweep I-V Curve, IO Pin to GND 
Figure 9. Differential Insertion Loss 
Figure 2. Negative TLP Curve, Connector side IO Pin to GND (Plotted as positive TLP from GND to IO, tp=100ns ) 
Figure 4. Clamping voltage waveform for -8kV IEC 61000-4-2 stress. See Figure 11 for details. 
Figure 6. Capacitance vs. Bias Voltage at 25 degree Celsius 
Figure 8. Leakage Current vs Temperature, IO Pin to GND, at 2.5 V Bias 
Figure 10. Capacitance vs Frequency