ZHCSHL9A February 2018 – March 2018 ESD224
PRODUCTION DATA.
| THERMAL METRIC(1) | ESD224 | UNIT | |
|---|---|---|---|
| DQA (USON) | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 173.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 109.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 14.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 77.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |