ZHCSKE9C December 2015 – October 2019 DS250DF810
PRODUCTION DATA.
| THERMAL METRIC(2) | CONDITIONS/ ASSUMPTIONS(1) | UNIT | ||||
|---|---|---|---|---|---|---|
| 4-layer JEDEC Board | 10-layer 8in x 6in Board | 20-layer 8in x 6in Board | 30-layer 8in x 6in Board | |||
| RθJA | Junction-to-ambient thermal resistance | 26.4 | 9.3 | 8.5 | 8.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 1.6 | - | - | - | |
| RθJB | Junction-to-board thermal resistance | 9.3 | - | - | - | |
| ΨJT | Junction-to-top characterization parameter | 0.1 | 0.1 | 0.1 | 0.1 | |
| ΨJB | Junction-to-board characterization parameter | 9.3 | 5 | 4.9 | 4.6 | |