SLVSBW9C April 2013 – December 2015 DRV8832-Q1
PRODUCTION DATA.
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | DRV8832-Q1 | UNIT | |
|---|---|---|---|
| DGQ (MSOP) | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 69.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 63.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 51.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 23.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 9.5 | °C/W |