ZHCSRG7 January 2023 DRV2901
PRODUCTION DATA
| THERMAL METRIC(1) | DRV2901 | UNIT | |
|---|---|---|---|
| DDV 44-PINS HTSSOP | |||
| JEDEC STANDARD 4 LAYER PCB | |||
| RθJA | Junction-to-ambient thermal resistance | 50.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.36 | °C/W |
| RθJB | Junction-to-board thermal resistance | 24.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.19 | °C/W |
| ψJB | Junction-to-board characterization parameter | 24.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |