ZHCSFB0D June 2016 – November 2023 DRV2510-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | DRV2510-Q1 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| {16} PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 39.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 24.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 20 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 19.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2 | °C/W |