ZHCSFD6G july   2016  – august 2023 DP83822H , DP83822HF , DP83822I , DP83822IF

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 應(yīng)用
4. 3 說(shuō)明
5. 4 Revision History
6. 5 Device Comparison Table
7. 6 Pin Configuration and Functions
8. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Electrical Characteristics
   6. 7.6  Timing Requirements, Power-Up Timing
   7. 7.7  Timing Requirements, Power-Up With Unstable XI Clock
   8. 7.8  Timing Requirements, Reset Timing
   9. 7.9  Timing Requirements, Serial Management Timing
   10. 7.10 Timing Requirements, 100 Mbps MII Transmit Timing
   11. 7.11 Timing Requirements, 100 Mbps MII Receive Timing
   12. 7.12 Timing Requirements, 10 Mbps MII Transmit Timing
   13. 7.13 Timing Requirements, 10 Mbps MII Receive Timing
   14. 7.14 Timing Requirements, RMII Transmit Timing
   15. 7.15 Timing Requirements, RMII Receive Timing
   16. 7.16 Timing Requirements, RGMII
   17. 7.17 Normal Link Pulse Timing
   18. 7.18 Auto-Negotiation Fast Link Pulse (FLP) Timing
   19. 7.19 10BASE-Te Jabber Timing
   20. 7.20 100BASE-TX Transmit Latency Timing
   21. 7.21 100BASE-TX Receive Latency Timing
   22. 7.22 Timing Diagrams
   23. 7.23 Typical Characteristics
9. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Energy Efficient Ethernet
         1. 8.3.1.1 EEE Overview
         2. 8.3.1.2 EEE Negotiation
      2. 8.3.2 Wake-on-LAN Packet Detection
         1. 8.3.2.1 Magic Packet Structure
         2. 8.3.2.2 Magic Packet Example
         3. 8.3.2.3 Wake-on-LAN Configuration and Status
      3. 8.3.3 Start of Frame Detect for IEEE 1588 Time Stamp
      4. 8.3.4 Clock Output
   4. 8.4 Device Functional Modes
      1. 8.4.1  MAC Interfaces
         1. 8.4.1.1 Media Independent Interface (MII)
         2. 8.4.1.2 Reduced Media Independent Interface (RMII)
         3. 8.4.1.3 Reduced Gigabit Media Independent Interface (RGMII)
      2. 8.4.2  Serial Management Interface
         1. 8.4.2.1 Extended Register Space Access
         2. 8.4.2.2 Write Address Operation
         3. 8.4.2.3 Read Address Operation
         4. 8.4.2.4 Write (No Post Increment) Operation
         5. 8.4.2.5 Read (No Post Increment) Operation
         6. 8.4.2.6 Write (Post Increment) Operation
         7. 8.4.2.7 Read (Post Increment) Operation
         8. 8.4.2.8 Example Write Operation (No Post Increment)
         9. 8.4.2.9 Example Read Operation (No Post Increment)
      3. 8.4.3  100BASE-TX
         1. 8.4.3.1 100BASE-TX Transmitter
            1. 8.4.3.1.1 Code-Group Encoding and Injection
            2. 8.4.3.1.2 Scrambler
            3. 8.4.3.1.3 NRZ to NRZI Encoder
            4. 8.4.3.1.4 Binary to MLT-3 Converter
         2. 8.4.3.2 100BASE-TX Receiver
      4. 8.4.4  100BASE-FX
         1. 8.4.4.1 100BASE-FX Transmit
         2. 8.4.4.2 100BASE-FX Receive
      5. 8.4.5  10BASE-Te
         1. 8.4.5.1 Squelch
         2. 8.4.5.2 Normal Link Pulse Detection and Generation
         3. 8.4.5.3 Jabber
         4. 8.4.5.4 Active Link Polarity Detection and Correction
      6. 8.4.6  Auto-Negotiation (Speed / Duplex Selection)
      7. 8.4.7  Auto-MDIX Resolution
      8. 8.4.8  Loopback Modes
         1. 8.4.8.1 Near-End Loopback
         2. 8.4.8.2 MII Loopback
         3. 8.4.8.3 PCS Loopback
         4. 8.4.8.4 Digital Loopback
         5. 8.4.8.5 Analog Loopback
         6. 8.4.8.6 Far-End (Reverse) Loopback
      9. 8.4.9  BIST Configurations
      10. 8.4.10 Cable Diagnostics
          1. 8.4.10.1 TDR
      11. 8.4.11 Fast Link Down Functionality
   5. 8.5 Programming
      1. 8.5.1 Hardware Bootstrap Configurations
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
   6. 8.6 Register Maps
10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
       1. 9.2.1 TPI Network Circuit
          1. 9.2.1.1 Design Requirements
          2. 9.2.1.2 Detailed Design Procedure
          3. 9.2.1.3 Application Curves
       2. 9.2.2 Fiber Network Circuit
          1. 9.2.2.1 Design Requirements
             1. 9.2.2.1.1 Clock Requirements
                1. 9.2.2.1.1.1 Oscillator
                2. 9.2.2.1.1.2 Crystal
          2. 9.2.2.2 Detailed Design Procedure
             1. 9.2.2.2.1 MII Layout Guidelines
             2. 9.2.2.2.2 RMII Layout Guidelines
             3. 9.2.2.2.3 RGMII Layout Guidelines
             4. 9.2.2.2.4 MDI Layout Guidelines
          3. 9.2.2.3 Application Curves
11. 10Power Supply Recommendations
    1. 10.1 Power Supply Characteristics
12. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Signal Traces
       2. 11.1.2 Return Path
       3. 11.1.3 Transformer Layout
          1. 11.1.3.1 Transformer Recommendations
       4. 11.1.4 Metal Pour
       5. 11.1.5 PCB Layer Stacking
    2. 11.2 Layout Example
13. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 接收文檔更新通知
    3. 12.3 支持資源
    4. 12.4 Trademarks
    5. 12.5 靜電放電警告
    6. 12.6 術(shù)語(yǔ)表
14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
       1. 13.1.1 Packaging Information
       2. 13.1.2 Tape and Reel Information