ZHCSFD6G july 2016 – august 2023 DP83822H , DP83822HF , DP83822I , DP83822IF
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Electrical Characteristics
- 7.6 Timing Requirements, Power-Up Timing
- 7.7 Timing Requirements, Power-Up With Unstable XI Clock
- 7.8 Timing Requirements, Reset Timing
- 7.9 Timing Requirements, Serial Management Timing
- 7.10 Timing Requirements, 100 Mbps MII Transmit Timing
- 7.11 Timing Requirements, 100 Mbps MII Receive Timing
- 7.12 Timing Requirements, 10 Mbps MII Transmit Timing
- 7.13 Timing Requirements, 10 Mbps MII Receive Timing
- 7.14 Timing Requirements, RMII Transmit Timing
- 7.15 Timing Requirements, RMII Receive Timing
- 7.16 Timing Requirements, RGMII
- 7.17 Normal Link Pulse Timing
- 7.18 Auto-Negotiation Fast Link Pulse (FLP) Timing
- 7.19 10BASE-Te Jabber Timing
- 7.20 100BASE-TX Transmit Latency Timing
- 7.21 100BASE-TX Receive Latency Timing
- 7.22 Timing Diagrams
- 7.23 Typical Characteristics
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 8.4
Device Functional Modes
- 8.4.1 MAC Interfaces
- 8.4.2
Serial Management Interface
- 8.4.2.1 Extended Register Space Access
- 8.4.2.2 Write Address Operation
- 8.4.2.3 Read Address Operation
- 8.4.2.4 Write (No Post Increment) Operation
- 8.4.2.5 Read (No Post Increment) Operation
- 8.4.2.6 Write (Post Increment) Operation
- 8.4.2.7 Read (Post Increment) Operation
- 8.4.2.8 Example Write Operation (No Post Increment)
- 8.4.2.9 Example Read Operation (No Post Increment)
- 8.4.3 100BASE-TX
- 8.4.4 100BASE-FX
- 8.4.5 10BASE-Te
- 8.4.6 Auto-Negotiation (Speed / Duplex Selection)
- 8.4.7 Auto-MDIX Resolution
- 8.4.8 Loopback Modes
- 8.4.9 BIST Configurations
- 8.4.10 Cable Diagnostics
- 8.4.11 Fast Link Down Functionality
- 8.5 Programming
- 8.6 Register Maps
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
12.5 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當的預防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細微的參數更改都可能會導致器件與其發布的規格不相符。 |