ZHCS764B February 2012 – September 2022 CSD25211W1015
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Electrical Characteristics
- 6 Thermal Characteristics
- 7 Typical MOSFET Characteristics
- 8 Mechanical Data
- 9 靜電放電警告
- 10Device and Documentation Support
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- YZC|6
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
6 Thermal Characteristics
(TA = 25°C unless otherwise stated)
| PARAMETER | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| R θJA | Thermal Resistance Junction to Ambient (Minimum Cu area) | 230 | °C/W | ||
| Thermal Resistance Junction to Ambient (1 in2 Cu area) | 149 | °C/W | |||
 | Max RθJA = 149°C/W when mounted on 1 inch2 of 2 oz. Cu. |  | Max RθJA = 230°C/W when mounted on minimum pad area of 2 oz. Cu. |