SCAS859F January 2009 – June 2015 CDCLVP111
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Applications and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
- RHB|32
訂購信息
11 Layout
11.1 Layout Guidelines
Power consumption of the CDCLVP111 can be high enough to require attention to thermal management. For reliability and performance reasons, the die temperature should be limited to a maximum of +110°C. That is, as an estimate, ambient temperature (TA) plus device power consumption times RθJA should not exceed +110°C.
The device package has an exposed pad that provides the primary heat removal path to the printed-circuit-board (PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a ground plane must be incorporated into the PCB within the footprint of the package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. Figure 19 shows a recommended land and via pattern.
11.2 Layout Example
Figure 19. Recommended PCB Layout
11.3 Thermal Management
Power consumption of the CDCLVP111 can be high enough to require attention to thermal management. For reliability and performance reasons, the die temperature should be limited to a maximum of +110°C. That is, as an estimate, ambient temperature (TA) plus device power consumption times RθJA should not exceed +110°C.
The device package has an exposed pad that provides the primary heat removal path to the printed-circuit-board (PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a ground plane must be incorporated into the PCB within the footprint of the package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. Figure 19 shows a recommended land and via pattern.